ESDC TECHNOLOGY SDN BHD ("PLAINTIFF/APPELLANT") vs HEITECH PADU BERHAD ("DEFENDANT/RESPONDENT")

HEITECH PADU BERHAD ("HEITECH" OR THE "COMPANY") PROPOSED PRIVATE PLACEMENT OF UP TO 10,122,520 NEW ORDINARY SHARES IN HEITECH ("HEITECH SHARES" OR "SHARES"), REPRESENTING 10% OF THE TOTAL NUMBER OF ISSUED SHARES OF HEITECH TO THIRD PARTY INVESTOR(S) TO BE IDENTIFIED AT A LATER DATE ("PROPOSED PRIVATE PLACEMENT")

HEITECH PADU BERHAD [199401024950 (310628-D)] ("HEITECH" OR "THE COMPANY") KUALA LUMPUR HIGH COURT SUIT NO: WA-22NCVC-72-02/2023 PERTUBUHAN KESELAMATAN SOSIAL (PLAINTIFF) VS HEITECH PADU BERHAD (DEFENDANT)

HEITECH PADU BERHAD ("HEITECH" OR THE "COMPANY") PROPOSED PRIVATE PLACEMENT OF UP TO 10,122,520 NEW ORDINARY SHARES IN HEITECH ("HEITECH SHARES" OR "SHARES"), REPRESENTING 10% OF THE TOTAL NUMBER OF ISSUED SHARES OF HEITECH TO THIRD PARTY INVESTOR(S) TO BE IDENTIFIED AT A LATER DATE ("PROPOSED PRIVATE PLACEMENT")

HEITECH PADU BERHAD BERHAD ("HEITECH" or "COMPANY") - TEAMING AGREEMENT ENTERED BETWEEN THE COMPANY AND MY E.G. SERVICES BERHAD

ACCEPTANCE ON THE LETTER OF AWARD (LOA) FOR TENDER PERKHIDMATAN PENYELENGGARAAN DAN SOKONGAN TEKNIKAL BAGI INFRASTRUKTUR ICT SERTA SISTEM INFORMASI KENDERAAN DAN PEMANDU (mySIKAP) DIPUSAT DATA DAN SEMUA PEJABAT JABATAN PENGANGKUTAN JALAN MALAYSIA.

HEITECH PADU BERHAD [199401024950 (310628-D)] ("HEITECH" OR "THE COMPANY") KUALA LUMPUR HIGH COURT SUIT NO: WA-22NCVC-72-02/2023 PERTUBUHAN KESELAMATAN SOSIAL (PLAINTIFF) VS HEITECH PADU BERHAD (DEFENDANT)

EXTENSION OF THE CONTRACT FOR PERKHIDMATAN PENYELENGGARAAN SISTEM APLIKASI MYIMMS SECARA KOMPREHENSIF DI JABATAN IMIGRESEN MALAYSIA (JIM).