NEW ISSUE OF SECURITIES (CHAPTER 6 OF LISTING REQUIREMENTS) : FUND RAISING HEITECH PADU BERHAD ("HEITECH" OR THE "COMPANY") PROPOSED PLACEMENT OF 10,000,000 NEW ORDINARY SHARES IN HEITECH TO REGAL ORION SDN BHD ("REGAL ORION" OR "PLACEE") AT THE ISSUE PRICE TO BE DETERMINED LATER ("PROPOSED PLACEMENT" OR "PROPOSAL")
| HEITECH PADU BERHAD |
| Type | Announcement |
| Subject | NEW ISSUE OF SECURITIES (CHAPTER 6 OF LISTING REQUIREMENTS) FUND RAISING |
| Description | HEITECH PADU BERHAD ("HEITECH" OR THE "COMPANY")
PROPOSED PLACEMENT OF 10,000,000 NEW ORDINARY SHARES IN HEITECH TO REGAL ORION SDN BHD ("REGAL ORION" OR "PLACEE") AT THE ISSUE PRICE TO BE DETERMINED LATER ("PROPOSED PLACEMENT" OR "PROPOSAL") |
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On behalf of the Board of Directors of HeiTech, MIDF Amanah Investment Bank Berhad wishes to announce that the Company proposes to undertake a Proposed Placement.
Please refer to the attachment for further details on the Proposed Placement.
This announcement is dated 24 June 2021. |
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Please refer attachment below.
Announcement Info
| Company Name | HEITECH PADU BERHAD |
| Stock Name | HTPADU |
| Date Announced | 24 Jun 2021 |
| Category | General Announcement for PLC |
| Reference Number | GA1-24062021-00076 |