NEW ISSUE OF SECURITIES (CHAPTER 6 OF LISTING REQUIREMENTS) : FUND RAISING HEITECH PADU BERHAD ("HEITECH" OR THE "COMPANY") PROPOSED PLACEMENT OF 10,000,000 NEW ORDINARY SHARES IN HEITECH TO REGAL ORION SDN BHD ("REGAL ORION" OR "PLACEE") AT THE ISSUE PRICE TO BE DETERMINED LATER ("PROPOSED PLACEMENT" OR "PROPOSAL")
| HEITECH PADU BERHAD |
| Type | Announcement |
| Subject | NEW ISSUE OF SECURITIES (CHAPTER 6 OF LISTING REQUIREMENTS) FUND RAISING |
| Description | HEITECH PADU BERHAD ("HEITECH" OR THE "COMPANY")
PROPOSED PLACEMENT OF 10,000,000 NEW ORDINARY SHARES IN HEITECH TO REGAL ORION SDN BHD ("REGAL ORION" OR "PLACEE") AT THE ISSUE PRICE TO BE DETERMINED LATER ("PROPOSED PLACEMENT" OR "PROPOSAL") |
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We refer to the announcement made on 24 June 2021 in relation to the Proposed Placement (“Announcement”). For consistency purposes, the abbreviations used in this announcement are the same as those previously defined in the Announcement unless otherwise defined herein.
On behalf of the Board, MIDF Investment wishes to announce that the listing application in relation to the Proposed Placement has been submitted to Bursa Securities on 30 June 2021.
This announcement is dated 30 June 2021. |
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Announcement Info
| Company Name | HEITECH PADU BERHAD |
| Stock Name | HTPADU |
| Date Announced | 30 Jun 2021 |
| Category | General Announcement for PLC |
| Reference Number | GA1-30062021-00088 |