NEW ISSUE OF SECURITIES (CHAPTER 6 OF LISTING REQUIREMENTS) : FUND RAISING HEITECH PADU BERHAD ("HEITECH" OR THE "COMPANY") PROPOSED PLACEMENT OF 10,000,000 NEW ORDINARY SHARES IN HEITECH TO REGAL ORION SDN BHD ("REGAL ORION" OR "PLACEE") AT THE ISSUE PRICE TO BE DETERMINED LATER ("PROPOSED PLACEMENT" OR "PROPOSAL")
| HEITECH PADU BERHAD |
| Type | Announcement |
| Subject | NEW ISSUE OF SECURITIES (CHAPTER 6 OF LISTING REQUIREMENTS) FUND RAISING |
| Description | HEITECH PADU BERHAD ("HEITECH" OR THE "COMPANY") PROPOSED PLACEMENT OF 10,000,000 NEW ORDINARY SHARES IN HEITECH TO REGAL ORION SDN BHD ("REGAL ORION" OR "PLACEE") AT THE ISSUE PRICE TO BE DETERMINED LATER ("PROPOSED PLACEMENT" OR "PROPOSAL") |
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We refer to the announcements made on 24 June 2021 and 30 June 2021 in relation to the Proposed Placement. For consistency purposes, the abbreviations used in this announcement are the same as those previously defined in the announcement dated 24 June 2021 unless otherwise defined herein. On behalf of the Board, MIDF Investment wishes to announce additional information in relation to the Proposed Placement as set out in the attachment. This announcement is dated 12 July 2021. |
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Please refer attachment below.
Announcement Info
| Company Name | HEITECH PADU BERHAD |
| Stock Name | HTPADU |
| Date Announced | 12 Jul 2021 |
| Category | General Announcement for PLC |
| Reference Number | GA1-12072021-00018 |