NEW ISSUE OF SECURITIES (CHAPTER 6 OF LISTING REQUIREMENTS) : FUND RAISING HEITECH PADU BERHAD ("HEITECH" OR THE "COMPANY") PROPOSED PLACEMENT OF 10,000,000 NEW ORDINARY SHARES IN HEITECH TO REGAL ORION SDN BHD ("REGAL ORION" OR "PLACEE") AT THE ISSUE PRICE TO BE DETERMINED LATER ("PROPOSED PLACEMENT" OR "PROPOSAL")
| HEITECH PADU BERHAD |
| Type | Announcement |
| Subject | NEW ISSUE OF SECURITIES (CHAPTER 6 OF LISTING REQUIREMENTS) FUND RAISING |
| Description | HEITECH PADU BERHAD ("HEITECH" OR THE "COMPANY")
PROPOSED PLACEMENT OF 10,000,000 NEW ORDINARY SHARES IN HEITECH TO REGAL ORION SDN BHD ("REGAL ORION" OR "PLACEE") AT THE ISSUE PRICE TO BE DETERMINED LATER ("PROPOSED PLACEMENT" OR "PROPOSAL") |
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We refer to the earlier announcements dated 24 June 2021, 30 June 2021 and 12 July 2021 in relation to the Proposed Placement. For consistency purposes, the abbreviations used in this announcement are the same as those previously defined in the announcement dated 24 June 2021 unless otherwise defined herein. On behalf of the Board, MIDF Investment wishes to announce that Bursa Securities had, vide its letter dated 19 July 2021, approved the listing of and quotation for 10,000,000 Placement Shares to be issued pursuant to the Proposed Placement. The approval by Bursa Securities is subject to the following conditions: (i) HeiTech and MIDF Investment must fully comply with the relevant provisions under the MMLR pertaining to the implementation of the Proposed Placement; (ii) HeiTech and MIDF Investment to inform Bursa Securities upon the completion of the Proposed Placement; and (iii) HeiTech to furnish Bursa Securities with a written confirmation of its compliance with the terms and conditions of Bursa Securities’ approval once the Proposed Placement is completed. This announcement is dated 21 July 2021. |
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Announcement Info
| Company Name | HEITECH PADU BERHAD |
| Stock Name | HTPADU |
| Date Announced | 21 Jul 2021 |
| Category | General Announcement for PLC |
| Reference Number | GA1-21072021-00039 |