NEW ISSUE OF SECURITIES (CHAPTER 6 OF LISTING REQUIREMENTS) : FUND RAISING PRIVATE PLACEMENT OF NEW ORDINARY SHARES IN HWGB, REPRESENTING UP TO 10% OF THE TOTAL NUMBER OF ISSUED SHARES IN HWGB ("PRIVATE PLACEMENT")
| HO WAH GENTING BERHAD |
| Type | Announcement |
| Subject | NEW ISSUE OF SECURITIES (CHAPTER 6 OF LISTING REQUIREMENTS) FUND RAISING |
| Description | PRIVATE PLACEMENT OF NEW ORDINARY SHARES IN HWGB, REPRESENTING UP TO 10% OF THE TOTAL NUMBER OF ISSUED SHARES IN HWGB ("PRIVATE PLACEMENT") |
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We refer to the announcements dated 12 January 2021, 13 January 2021, 21 January 2021, 29 January 2021 and 9 July 2021 in relation to the Private Placement (“Announcements”). Unless otherwise defined, the definitions set out in the Announcements shall apply herein.
On behalf of the Board, AmInvestment Bank wishes to announce that the Board had on 22 July 2021 fixed the issue price for the second tranche of the Placement Shares at RM0.2650 per Placement Share (“Issue Price”).
The Issue Price represents a discount of RM0.0287 or 9.77% to the 5D-VWAMP of HWGB Shares up to and including 21 July 2021 of RM0.2937 per HWGB Share.
This announcement is dated 22 July 2021. |
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Announcement Info
| Company Name | HO WAH GENTING BERHAD |
| Stock Name | HWGB |
| Date Announced | 22 Jul 2021 |
| Category | General Announcement for PLC |
| Reference Number | GA1-31052021-00050 |