HTPADU

2.140

-0.16 (-7%)

MATERIAL LITIGATION HEITECH PADU BERHAD [199401024950 (310628-D)] ("HEITECH" OR "THE COMPANY") KUALA LUMPUR HIGH COURT SUIT NO: WA-22NCVC-72-02/2023 PERTUBUHAN KESELAMATAN SOSIAL (PLAINTIFF) VS HEITECH PADU BERHAD (DEFENDANT)

HEITECH PADU BERHAD

Type Announcement
Subject MATERIAL LITIGATION
Description
HEITECH PADU BERHAD [199401024950 (310628-D)] ("HEITECH" OR "THE COMPANY") KUALA LUMPUR HIGH COURT SUIT NO: WA-22NCVC-72-02/2023 PERTUBUHAN KESELAMATAN SOSIAL (PLAINTIFF) VS HEITECH PADU BERHAD (DEFENDANT)

Reference is made to the Company's announcements dated 1st March 2023 and 27th March 2023 on the above matter.

 

Unless otherwise defined, the terms used herein shall have the same meaning as defined in the announcements.

 

The Board of Directors of HeiTech wishes to announce that both Parties have filed and served their Defence & Counterclaim and Reply & Defence to the Counterclaim respectively. The Defendant in their Defence and Counterclaim seeks the following relief:-

  1. the sum of RM6,615,157.61 for work done until the Plaintiff’s unilateral termination on 25.6.2021;
  2. the sum of RM6,539,141.39 being expectation loss as a result the said termination;
  3. the sum of RM1,726,258.61 for the additional works done and supply of Hardware, Software and Services;
  4. General damages to be assessed by this Honourable Court, where applicable;
  5. Pre-judgment interest on all sum ordered to be paid by the Plaintiff to the Defendant at the rate of 5% per annum calculated from the date of termination 25.6.2021 until the date of judgment;
  6. Post-judgment interest on all sum ordered to be paid by the Plaintiff to the Defendant at the rate of 5% per annum calculated from the date of judgment until full settlement;
  7. Costs; and
  8. Any other reliefs that this Honourable Court deems fit and proper.

 

In relation to the Case Management held today on 10th May 2023, the Court has granted an extension of time of 2 weeks for the Parties to file an interlocutory application (if any).

 

The next case management has been fixed for 24th May 2023.

 

Any further material development of the above matter will be announced in due course.

 

This announcement is dated 10th May 2023.






Announcement Info

Company Name HEITECH PADU BERHAD
Stock Name HTPADU
Date Announced 10 May 2023
Category General Announcement for PLC
Reference Number GA1-10052023-00075