MATERIAL LITIGATION HEITECH PADU BERHAD [199401024950 (310628-D)] ("HEITECH" OR "THE COMPANY") KUALA LUMPUR HIGH COURT SUIT NO: WA-22NCVC-72-02/2023 PERTUBUHAN KESELAMATAN SOSIAL (PLAINTIFF) VS HEITECH PADU BERHAD (DEFENDANT)
HEITECH PADU BERHAD |
Type | Announcement |
Subject | MATERIAL LITIGATION |
Description | HEITECH PADU BERHAD [199401024950 (310628-D)] ("HEITECH" OR "THE COMPANY") KUALA LUMPUR HIGH COURT SUIT NO: WA-22NCVC-72-02/2023 PERTUBUHAN KESELAMATAN SOSIAL (PLAINTIFF) VS HEITECH PADU BERHAD (DEFENDANT) |
Reference is made to the Company's announcements dated 1st March 2023 and 27th March 2023 on the above matter.
Unless otherwise defined, the terms used herein shall have the same meaning as defined in the announcements.
The Board of Directors of HeiTech wishes to announce that both Parties have filed and served their Defence & Counterclaim and Reply & Defence to the Counterclaim respectively. The Defendant in their Defence and Counterclaim seeks the following relief:-
In relation to the Case Management held today on 10th May 2023, the Court has granted an extension of time of 2 weeks for the Parties to file an interlocutory application (if any).
The next case management has been fixed for 24th May 2023.
Any further material development of the above matter will be announced in due course.
This announcement is dated 10th May 2023. |
Announcement Info
Company Name | HEITECH PADU BERHAD |
Stock Name | HTPADU |
Date Announced | 10 May 2023 |
Category | General Announcement for PLC |
Reference Number | GA1-10052023-00075 |