HSSEB

0.975

-0.01 (-1%)

NEW ISSUE OF SECURITIES (CHAPTER 6 OF LISTING REQUIREMENTS) : FUND RAISING HSS ENGINEERS BERHAD ("HEB" OR THE "COMPANY") PRIVATE PLACEMENT OF UP TO 49,590,000 NEW ORDINARY SHARES IN THE COMPANY, REPRESENTING UP TO 10% OF THE TOTAL ISSUED AND PAID-UP SHARE CAPITAL OF THE COMPANY ("PRIVATE PLACEMENT")

HSS ENGINEERS BERHAD

Type Announcement
Subject NEW ISSUE OF SECURITIES (CHAPTER 6 OF LISTING REQUIREMENTS)
FUND RAISING
Description
HSS ENGINEERS BERHAD ("HEB" OR THE "COMPANY")

PRIVATE PLACEMENT OF UP TO 49,590,000 NEW ORDINARY SHARES IN THE COMPANY, REPRESENTING UP TO 10% OF THE TOTAL ISSUED AND PAID-UP SHARE CAPITAL OF THE COMPANY ("PRIVATE PLACEMENT")

Abbreviations used herein shall, unless otherwise redefined, mean the same as those defined in the Company’s announcements dated 17 November 2023, 22 November 2023, 23 November 2023, 6 December 2023 and 11 December 2023 (collectively referred to as the “Announcements”).

 

On behalf of the Board of Directors of HEB, M&A Securities is pleased to announce that the Board has on 24 January 2024 (“Price-Fixing Date”) fixed the issue price for the first tranche of the Private Placement at RM1.11 per Placement Share (“First Tranche”).

 

This issue price of RM1.11 per Placement Share for the First Tranche represents a discount of approximately RM0.0491 or 4.236% from the 5D-VWAP of HEB up to and including 23 January 2024, being the last market date immediately before the Price-Fixing Date, of approximately RM1.1591 per Placement Share.

 

This announcement is dated 24 January 2024.






Announcement Info

Company Name HSS ENGINEERS BERHAD
Stock Name HSSEB
Date Announced 24 Jan 2024
Category General Announcement for PLC
Reference Number GA1-24012024-00040