HTPADU

2.050

-0.03 (-1.4%)

NEW ISSUE OF SECURITIES (CHAPTER 6 OF LISTING REQUIREMENTS) : FUND RAISING HEITECH PADU BERHAD ("HEITECH" OR THE "COMPANY") PROPOSED PRIVATE PLACEMENT OF UP TO 10,122,520 NEW ORDINARY SHARES IN HEITECH ("HEITECH SHARES"), REPRESENTING 10% OF THE TOTAL NUMBER OF ISSUED SHARES OF HEITECH TO THIRD PARTY INVESTOR(S) TO BE IDENTIFIED AT A LATER DATE ("PROPOSED PRIVATE PLACEMENT")

HEITECH PADU BERHAD

Type Announcement
Subject NEW ISSUE OF SECURITIES (CHAPTER 6 OF LISTING REQUIREMENTS)
FUND RAISING
Description
HEITECH PADU BERHAD ("HEITECH" OR THE "COMPANY")

PROPOSED PRIVATE PLACEMENT OF UP TO 10,122,520 NEW ORDINARY SHARES IN HEITECH ("HEITECH SHARES"), REPRESENTING 10% OF THE TOTAL NUMBER OF ISSUED SHARES OF HEITECH TO THIRD PARTY INVESTOR(S) TO BE IDENTIFIED AT A LATER DATE ("PROPOSED PRIVATE PLACEMENT")

(Unless otherwise defined, defined terms used in this announcement shall carry the same meaning as defined in the announcements dated 17 April 2024 and 22 April 2024 in relation to the Proposed Private Placement (“Announcements”)).

On behalf of the Board, MIDF Investment wishes to announce additional information in relation to the Proposed Private Placement as set out in the attachment.

This announcement is dated 26 April 2024.




Please refer attachment below.



Announcement Info

Company Name HEITECH PADU BERHAD
Stock Name HTPADU
Date Announced 26 Apr 2024
Category General Announcement for PLC
Reference Number GA1-26042024-00017