ACCEPTANCE ON THE LETTER OF AWARD (LOA) FOR TENDER MEMBANGUN, MEMBEKAL, MENGHANTAR, MEMASANG, MENGKONFIGURASI, MENGINTEGRASI, MENGUJI DAN MENTAULIAH PERKAKASAN, PERISIAN DAN SISTEM DIGITAL JABATAN PENGANGKUTAN JALAN (REVAMP)

HEITECH PADU BERHAD [199401024950 (310628-D)] ("HEITECH" OR "THE COMPANY") KUALA LUMPUR HIGH COURT SUIT NO: WA-22NCVC-72-02/2023 PERTUBUHAN KESELAMATAN SOSIAL (PLAINTIFF) VS HEITECH PADU BERHAD (DEFENDANT)

HEITECH GROUP BERHAD ("HEITECH" OR "THE COMPANY") - CHANGES TO THE COMPOSITION OF THE BOARD COMMITTEES

HEITECH PADU BERHAD [199401024950 (310628-D)] ("HEITECH" OR "THE COMPANY") KUALA LUMPUR HIGH COURT SUIT NO: WA-22NCVC-72-02/2023 PERTUBUHAN KESELAMATAN SOSIAL (PLAINTIFF) VS HEITECH PADU BERHAD (DEFENDANT)

PRIVATE PLACEMENT OF UP TO 10,122,520 NEW ORDINARY SHARES IN HEITECH ("HEITECH SHARES"), REPRESENTING 10% OF THE TOTAL NUMBER OF ISSUED SHARES OF HEITECH TO THIRD PARTY INVESTOR(S) TO BE IDENTIFIED AT A LATER DATE ("PRIVATE PLACEMENT")

HEITECH PADU BERHAD ("HEITECH" OR THE "COMPANY") PRIVATE PLACEMENT OF UP TO 10,122,520 NEW ORDINARY SHARES IN HEITECH ("HEITECH SHARES"), REPRESENTING 10% OF THE TOTAL NUMBER OF ISSUED SHARES OF HEITECH TO THIRD PARTY INVESTOR(S) TO BE IDENTIFIED AT A LATER DATE ("PRIVATE PLACEMENT")

HEITECH PADU BERHAD [199401024950 (310628-D)] ("HEITECH" OR "THE COMPANY") KUALA LUMPUR HIGH COURT SUIT NO: WA-22NCVC-72-02/2023 PERTUBUHAN KESELAMATAN SOSIAL (PLAINTIFF) VS HEITECH PADU BERHAD (DEFENDANT)