HWGB

0.110

+0.005 (+4.8%)

MULTIPLE PROPOSALS HO WAH GENTING BERHAD ("HWGB" OR THE "COMPANY") (I) PROPOSED DEBT SETTLEMENT; AND (II) PROPOSED PRIVATE PLACEMENT (COLLECTIVELY, "PROPOSALS")

HO WAH GENTING BERHAD

Type Announcement
Subject MULTIPLE PROPOSALS
Description
HO WAH GENTING BERHAD ("HWGB" OR THE "COMPANY") 

(I)	PROPOSED DEBT SETTLEMENT; AND
(II)	PROPOSED PRIVATE PLACEMENT

(COLLECTIVELY, "PROPOSALS")

On behalf of the Board of Directors of HWGB (“Board”), M & A Securities Sdn Bhd (“M & A Securities”) wishes to announce that the Company proposes to undertake the following:

  1. proposed settlement of an aggregate amount of RM3,299,000 debt owing to Advance Opportunities Fund (“AOF”) and Advance Opportunities Fund I (“AOF I”) by the Company (“Settlement Amount”), via the issuance of up to 20,554,700 new ordinary shares in HWGB (“HWGB Share(s)” or “Share(s)”) (“Settlement Share(s)”), at an issue price to be determined and fixed at a later date (“Proposed Debt Settlement”); and
  2. proposed private placement of up to 20,554,700 new HWGB Shares (“Placement Share(s)”), which was arrived based on 10.00% of the total number of issued HWGB Shares (excluding treasury shares, if any), at an issue price to be determined and fixed at a later date (“Proposed Private Placement”).

Further details of the Proposals are set out as attached.

 

This announcement is dated 12 November 2025.




Please refer attachment below.



Announcement Info

Company Name HO WAH GENTING BERHAD
Stock Name HWGB
Date Announced 12 Nov 2025
Category General Announcement for PLC
Reference Number GA1-12112025-00015