MULTIPLE PROPOSALS HO WAH GENTING BERHAD ("HWGB" OR THE "COMPANY") (I) DEBT SETTLEMENT; AND (II) PRIVATE PLACEMENT (COLLECTIVELY, "CORPORATE EXERCISES")
| HO WAH GENTING BERHAD |
| Type | Announcement |
| Subject | MULTIPLE PROPOSALS |
| Description | HO WAH GENTING BERHAD ("HWGB" OR THE "COMPANY")
(I) DEBT SETTLEMENT; AND
(II) PRIVATE PLACEMENT
(COLLECTIVELY, "CORPORATE EXERCISES") |
|
Unless otherwise defined, the definitions set out in the announcement dated 12 November 2025, 19 November 2025, 21 January 2026 and 13 February 2026 (“Announcements”) shall apply herein.
On behalf of the Board, M & A Securities wishes to announce that the Board intends to fix the issue price of the Settlement Shares at RM0.1181 per Settlement Share (“Settlement Share Issue Price”) and the issue price of the Placement Shares at RM0.1181 per Placement Share (“Placement Share Issue Price”).
The Settlement Share Issue Price and the Placement Share Issue Price represent a discount of RM0.0131 or approximately 10.0% to the 5D-VWAMP of HWGB Shares up to and including 20 February 2026 (being the market day immediately preceding the date of this announcement) of RM0.1312 per Share.
This announcement is dated 23 February 2026. |
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Announcement Info
| Company Name | HO WAH GENTING BERHAD |
| Stock Name | HWGB |
| Date Announced | 23 Feb 2026 |
| Category | General Announcement for PLC |
| Reference Number | GA1-23022026-00093 |