Our website is made possible by displaying non-intrusive online advertisements to our visitors.
Please consider supporting us by disabling or pausing your ad blocker.
NEW ISSUE OF SECURITIES (CHAPTER 6 OF LISTING REQUIREMENTS) : FUND RAISING SUNVIEW GROUP BERHAD ("SUNVIEW" OR THE "COMPANY")
PRIVATE PLACEMENT OF UP TO 10% OF THE TOTAL NUMBER OF ISSUED SHARES OF SUNVIEW (EXCLUDING TREASURY SHARES, IF ANY) ("PRIVATE PLACEMENT")
SUNVIEW GROUP BERHAD
Type
Announcement
Subject
NEW ISSUE OF SECURITIES (CHAPTER 6 OF LISTING REQUIREMENTS)
FUND RAISING
Description
SUNVIEW GROUP BERHAD ("SUNVIEW" OR THE "COMPANY")
PRIVATE PLACEMENT OF UP TO 10% OF THE TOTAL NUMBER OF ISSUED SHARES OF SUNVIEW (EXCLUDING TREASURY SHARES, IF ANY) ("PRIVATE PLACEMENT")
We refer to the announcements dated 14 January 2026, 15 January 2026, 22 January 2026 and 28 January 2026 in relation to the Private Placement ("Announcements"). Unless otherwise defined, the definitions set out in the Announcements shall apply herein.
On behalf of the Board, Kenanga IB wishes to announce that the Board had on 18 March 2026 resolved to fix the issue price for the first tranche of the Placement Shares at RM0.3175 per Placement Share ("Issue Price").
The Issue Price of RM0.3175 represents a discount of RM0.0352 or approximately 9.98% to the 5-day VWAMP of Sunview Shares up to and including 17 March 2026, being the last trading day immediately before the price-fixing date of RM0.3527.