Unless otherwise defined, the definitions used in this announcement shall have the same meaning as those defined in the Company's announcements dated 27 April 2026, 28 April 2026, 12 May 2026, 15 May 2026 and 18 May 2026 in relation to the Private Placement.
On behalf of the Board, M&A Securities is pleased to announce that the Board has on 7 July 2026 fixed the issue price at RM0.2680 per Placement Share to be issued pursuant to the Private Placement.
The aforementioned issue price of RM0.2680 per Placement Share represents a discount of approximately 9.9% or RM0.0296 to the 5D-VWAMP of ES Sunlogy Shares from 30 June 2026 to 6 July 2026 of approximately RM0.2976 per ES Sunlogy Share.
This announcement is dated 7 July 2026.