MATERIAL LITIGATION HEITECH PADU BERHAD [199401024950 (310628-D)] ("HEITECH" OR "THE COMPANY") KUALA LUMPUR HIGH COURT SUIT NO: WA-22NCVC-72-02/2023 PERTUBUHAN KESELAMATAN SOSIAL (PLAINTIFF) VS HEITECH PADU BERHAD (DEFENDANT)
| HEITECH PADU BERHAD |
| Type | Announcement |
| Subject | MATERIAL LITIGATION |
| Description | HEITECH PADU BERHAD [199401024950 (310628-D)] ("HEITECH" OR "THE COMPANY") KUALA LUMPUR HIGH COURT SUIT NO: WA-22NCVC-72-02/2023 PERTUBUHAN KESELAMATAN SOSIAL (PLAINTIFF) VS HEITECH PADU BERHAD (DEFENDANT) |
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Reference is made to the Company's announcement dated 1 March 2023 on the above matter.
Unless otherwise defined, the terms used herein shall have the same meaning as defined in the announcement.
The Board of Directors of HeiTech wishes to announce that with regard to the case management held today on 27th March 2023, the Court has given a direction for the Company to file and serve the Defence and Counterclaim on or before 10th April 2023.
The next case management has been fixed for 10th May 2023.
Any further material development of the above matter will be announced in due course.
This announcement is dated 27 March 2023. |
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Announcement Info
| Company Name | HEITECH PADU BERHAD |
| Stock Name | HTPADU |
| Date Announced | 27 Mar 2023 |
| Category | General Announcement for PLC |
| Reference Number | GA1-27032023-00034 |