HTPADU

1.700

-0.02 (-1.2%)

MATERIAL LITIGATION HEITECH PADU BERHAD [199401024950 (310628-D)] ("HEITECH" OR "THE COMPANY") KUALA LUMPUR HIGH COURT SUIT NO: WA-22NCVC-72-02/2023 PERTUBUHAN KESELAMATAN SOSIAL (PLAINTIFF) VS HEITECH PADU BERHAD (DEFENDANT)

HEITECH PADU BERHAD

Type Announcement
Subject MATERIAL LITIGATION
Description
HEITECH PADU BERHAD [199401024950 (310628-D)] ("HEITECH" OR "THE COMPANY") KUALA LUMPUR HIGH COURT SUIT NO: WA-22NCVC-72-02/2023 PERTUBUHAN KESELAMATAN SOSIAL (PLAINTIFF) VS HEITECH PADU BERHAD (DEFENDANT)

Reference is made to the Company's announcements dated 1st March 2023, 27th March 2023, 10th May 2023 and 25th May 2023 respectively on the above matter.

 

Unless otherwise defined, the terms used herein shall have the same meaning as defined in the announcements.

 

The Board of Directors of HeiTech wishes to announce that HeiTech’s solicitors attended the  Hearing held on 9th August 2023 in relation to the HeiTech’s (Defendant's) application under Order 14A and Order 33 Rules of Court 2012: To Summarily Determine the Plaintiff’s Claim (‘Application’). The Court has given the following directions: -

 

  1. Defendant to file further written submission on or before 11th August 2023; and
  2. Plaintiff to file written submission in reply, if any, on or before 16th August 2023.

 

The decision for the Application is fixed for 9th November 2023.

 

Any further material development of the above matter will be announced in due course.

 

This announcement is dated 9th August 2023.






Announcement Info

Company Name HEITECH PADU BERHAD
Stock Name HTPADU
Date Announced 09 Aug 2023
Category General Announcement for PLC
Reference Number GA1-09082023-00054