NEW ISSUE OF SECURITIES (CHAPTER 6 OF LISTING REQUIREMENTS) : FUND RAISING HO WAH GENTING BERHAD ("HWGB" OR "COMPANY") PROPOSED PRIVATE PLACEMENT OF UP TO 10% OF THE TOTAL NUMBER OF ISSUED SHARES IN HWGB ("PROPOSED PRIVATE PLACEMENT")
| HO WAH GENTING BERHAD |
| Type | Announcement |
| Subject | NEW ISSUE OF SECURITIES (CHAPTER 6 OF LISTING REQUIREMENTS) FUND RAISING |
| Description | HO WAH GENTING BERHAD ("HWGB" OR "COMPANY")
PROPOSED PRIVATE PLACEMENT OF UP TO 10% OF THE TOTAL NUMBER OF ISSUED SHARES IN HWGB ("PROPOSED PRIVATE PLACEMENT") |
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Unless otherwise stated or redefined, all abbreviations and definitions used herein shall have the same meanings as those used in the Company’s announcement dated 22 April 2025 in relation to the Proposed Private Placement ("Announcement").
Further to the Announcement in relation to the Proposed Private Placement, M&A Securities on behalf of the Board wishes to announce further information in relation to the Proposed Private Placement as set out in the attachment below.
This announcement is dated 14 May 2025. |
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Please refer attachment below.
Announcement Info
| Company Name | HO WAH GENTING BERHAD |
| Stock Name | HWGB |
| Date Announced | 14 May 2025 |
| Category | General Announcement for PLC |
| Reference Number | GA1-14052025-00057 |