OTHERS Key ASIC Wins RM13.1 Million AI Chip Design Deal - High-Performance, Ultra-Low Power Chip to Drive Global AI Market Expansion
| KEY ASIC BERHAD |
| Type | Announcement |
| Subject | OTHERS |
| Description | Key ASIC Wins RM13.1 Million AI Chip Design Deal - High-Performance, Ultra-Low Power Chip to Drive Global AI Market Expansion |
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Pursuant to Paragraph 9.03 of the Main Market Listing Requirements of Bursa Malaysia Securities Berhad, the Board of Directors of Key ASIC wishes to announce that Key ASIC had on 1 July 2025 been awarded an AI chip design contract from a leading technology company for contract value of RM13.1 Million.
Please refer to the attachment for the details of the announcement.
This announcement is dated 1 July 2025. |
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Please refer attachment below.
Announcement Info
| Company Name | KEY ASIC BERHAD |
| Stock Name | KEYASIC |
| Date Announced | 01 Jul 2025 |
| Category | General Announcement for PLC |
| Reference Number | GA1-01072025-00054 |